VDC Research: Embedded Microprocessor, Board & Systems Market Blog

Highlights from FTF2015: Seeding Companies with Technology to Create Secure IoT Devices

• Several new Freescale processors announced from secure MCUs to multicore SoCs
• FTF product showcases spanned automobiles, hospital beds, IoT gateways, and much more
• NXP integration ongoing; expected to wrap up end of year
• Merger adds embedded security capabilities, ID solutions, sensors

Freescale hosted another successful Freescale Technology Forum (FTF) last week in Austin, TX at the brand new JW Marriott and the company kept everyone buzzing with its new product announcements, updates on the NXP merger, and product showcases. In addition, we were treated with expansive and interactive keynotes by CEO Gregg Lowe who demonstrated a variety of ways in which Freescale is fostering an ecosystem dedicated to accelerating the development of next-generation systems as well as Apple co-founder, Steve Wozniak. 

The merger with NXP was an extremely hot topic with everyone clamoring for answers as to the implications of such a large acquisition for both sides. Back when the merger was first announced earlier this year, I found the unity to be synergistic  with little overlap. The area with the greatest overlap between the two companies, RF products, was resolved in May with the sale of NXP’s RF Power business to Chinese private equity firm JAC Capital. Both Freescale and NXP have teams of 30-40 personnel aggressively working towards the integration of the companies. It was apparent at the event, though, that much is still to be done in terms of planning for the alignment of specific product families and integrating solutions between the two organizations.

The motivation behind the acquisition of NXP is multifaceted. First, security is paramount to the development of IoT products and solutions. The addition of NXP’s security IP will amplify Freescale’s penetration of such connected applications and facilitate the development of more-comprehensive solutions. Not to be forgotten is that both companies have seen strong growth in terms of revenues and profit margin and investor requirements are pushing for consolidation within the maturing embedded processor landscape. The merger is expected to save the combined entity nearly $400M in OPEX and $100M in COGS. No plant closures are expected and the company is focused on making the transition at seamless as possible for customers (so no re-qualifying, no products being moved geographically, etc.).

Freescale took a unique approach to entering the Bluetooth Low Energy (BLE) realm (or Bluetooth Smart as they like to use) by also integrating an IEEE 802.15.4 radio (the foundation for ZigBee and Thread) on its newly announced Kinetis KW40Z wireless MCUs for a variety of IoT applications. In addition, Freescale’s royalty-free BLE host stack is planned to support the upcoming Bluetooth Smart Mesh networking protocol. The heterogeneous Kinetis KW40Z MCU (there will be SKUs with just Bluetooth or just 802.15.4 support as well) is ripe for adding further capability to many of the emerging HAN and IoT applications leveraging mesh networks including smart lighting, smart door locks, building automation, as well as asset or fitness monitoring.

Other embedded processor announcements included:

• S32K MCUs – A new automotive MCU line aimed to significantly simplify software development
• K8X MCU Family – Highly-secure ARM Cortex-M MCUs
• 16nm FinFET QuorIQ – Migration of Freescale’s multicore communications processors
• i.MX 6Dual SCM (single chip module) Family – First of its new SCM portfolio of small integrated systems; fits application processor, PMIC, flash memory, embedded sw/fw, and security on a board the size of a dime
• QorIQ LS1088A octal and LS1048A quad multicore processors based on ARM Cortex-A53 cores; lays the groundwork for the upcoming QorIQ LS2 processors with ARM Cortex-A72 cores
• i.MX 7 and i.MX 7Dual series processors featuring ARM Cortex-A7 and the ARM Cortex-M4 cores

Q&A with Freescale CEO Gregg Lowe and NXP CEO Richard Clemmer

My first ever rickshaw ride getting to the keynote

The Woz!

NXP and Freescale: A Genuine Marriage

NXP’s acquisition of Freescale to form a $40B company is much more than two organizations unifying under a common banner – it is the wedding of leading embedded technology suppliers with similar, yet different, market focus and goals. Both companies provide a rich mix of embedded processors, analog and mixed signal solutions, wireless ICs, and other hardware. While there is some overlap in the companies’ microcontroller, RF, and sensor products, the rest of Freescale and NXP’s offerings are hugely complimentary to each other with cross-selling opportunities in a variety of markets including automotive, consumer electronics, and industrial automation.

While the acquisition is not a revolutionary change in direction for NXP and its target verticals, the new combined company will feature a much broader software portfolio, new products, and much greater corporate size that will enable it to compete more effectively with other semiconductor juggernauts and align with growing user requirements for facilitating development of the software stack.

Freescale has carried strong corporate momentum over the last few years as a result of its aggressive push into the Internet of Things (IoT) and investments made facilitating software development for embedded engineers. Freescale supports a variety of software development tools and environments in addition to providing the free MQX real-time operating system (RTOS) and its commercial CodeWarrior OSEK RTOS. Freescale also provides a variety of software libraries, frameworks, protocol stacks, and more. NXP, on the other hand, has done very little to facilitate software development on its MCUs and other hardware products or to supply crucial components of the software stack – instead relying heavily on its software partners for support. Embedded software has been vital to Freescale’s embedded processor market share growth and differentiation.

The acquisition of Freescale propelled NXP to become the second-largest supplier of embedded MCUs in addition to now being a leading vendor of SoCs as well. The combined assets and offerings of Freescale and NXP will also enable the company to better compete with its rival in the embedded processors space, Renesas. While there are a lot of similarities between Freescale and NXP, the general disruption of a massive merger such as this will certainly challenge the steady revenue growth enjoyed by both companies during the past three years. Nonetheless, the combined company expects to be able to shed hundreds of millions of dollars each year as a result of expanded buying power and annual cost synergies.

One of the new vertical opportunities for NXP produced by the merger is in the communications and networking space for applications such as gateways, small cell base stations, SDN switches/routers, and network attached storage with the QuorIQ platforms and PowerQUICC communications processors. While the company could divest this particular business to maintain its focus on other industries, VDC believes NXP should maintain Freescale’s communications and networking processor lines to take advantage of the rampant growth expected in that space through 2018 (5-year revenue CAGR of 10.8%) caused by the growing strain on network operators and service providers due to pervasive mobile computing and the IoT.

The proposed merger (expected to close in 2H 2015) is hugely beneficial for both companies. For Freescale, the acquisition means being able to shed some of the lingering restrictions from its long-term corporate debt issues. For NXP, it’s an opportunity to become a much broader provider of embedded technology with higher margin products. The move also greatly bolsters its software support which is becoming increasingly important to embedded hardware value every year. It will be imperative that NXP continues to develop and build its investments in enabling software and tooling support to ensure a lasting, beneficial marriage of the company’s traditional and new businesses, products, and solutions.

Software Enablement is Critical to IoT & Embedded Processor Value

The value of an embedded processor is increasingly defined by its supporting software development tools and platforms, according to a recently published study by VDC Research. The most important selection criteria for embedded processors, according to VDC’s findings, is the availability of programming tools and software (see exhibit). The Internet of Things (IoT) will accelerate this trend as design teams wrestle with implementing often newfound low-power connectivity on systems that are generally more complex. Mitigating software development efforts is therefore an increasingly vital trait of embedded and IoT processor solutions.

Software development solutions are available from a variety of ecosystem players including processor vendors, core IP licensors, ISVs, and more. In fact, software enablement is a major component to the success of embedded processor market share leaders like Freescale, Intel, and Renesas. Freescale, for example, provides a variety of development tools tailored for its processor product families in addition to specific applications and functionality such as automotive and wireless connectivity. Software development capabilities are a major factor for third-party core architectures as well, as each has their own homegrown solutions supported by ecosystem partners. As a result, ARM, Imagination Technologies, and Intel have all made dramatic investments into their respective ecosystems for tooling, programming environments, OSs, middleware, and other software over the past several years.

Use and support of integrated development environments (IDEs) and more sophisticated software/systems engineering tools has grown in parallel with the increasing end-user requirements for more robust software stacks. Currently offered/supported by the majority of embedded processor vendors, IDEs help aggregate and centralize vendors’ development tools and other resources such as SDKs, application notes, sample programs, and more. "We expect it will become more critical for these vendors to extend the breadth of their offerings to incorporate other tools such as system configuration and automated testing tools," says VDC analyst Dan Mandell. "Embedded software requires the greatest distribution of development costs and resources for today’s projects and is a major opportunity for which processor vendors can add value/differentiation, attract new customers, and/or pursue new markets."

Embedded hardware suppliers have been forced to evolve from pushing devices to supporting comprehensive solutions. Beyond the core metrics of price and performance, software takes precedence among processor selection criteria. IDEs in particular have become a common battleground for swaying influence on purchasing decisions. Processor vendors will need to continue building their software expertise and support to encapsulate more end-user requirements and, ultimately, sell more hardware.

VDC’s recently published IoT & Embedded Processors market research report forecasts and analyzes the markets for commercially available CPUs, GPUs, MCUs, and SoCs and their role in powering future embedded systems. Click Here for more information about this study and our various other coverage areas.

STMicroelectronics Wins VDC’s ‘Best of Show’ Award with New F7 MCUs at ARM TechCon 2014!

VDC Research congratulates STMicroelectronics for being selected as the winner of our embedded hardware ‘Best of Show’ award at ARM TechCon 2014!

STMicroelectronics announced the STM32 F7 line of microcontrollers based on the new ARM Cortex-M7 architecture last week, and it had a functioning unit at its booth running various benchmarks side-by-side with an STM32 processor based on the Cortex-M4. The company compared the processing time needed to process 3 different types of data in separate tests based on ray tracing, fractal imaging, and 3D-vectorial computation. The Cortex-M7 device delivered almost twice the performance and digital signal processing of its predecessor. The STM32 F7 MCU series operates at frequencies up to 200 MHz using the core’s 6-stage superscalar pipeline to produce up to 1000 CoreMarks.

 

The new 32-bit Cortex-M7 processor architecture fills the midpoint between ARM’s current Cortex-M4 and low-end Cortex-A IP. It is targeted towards high-end embedded and IoT applications such as motor control, industrial automation, image processing, connected car, smart home, wearables, and more. Other leading ARM partners for the Cortex-M7 processor include Atmel and Freescale.

Once more, congratulations to STMicroelectronics!

We have another blog available from our time at ARM TechCon 2014 and JavaOne highlighting notable embedded security demonstrations and solutions.

For more information on our recently published Embedded Processors report, which analyzes the market for commercially available CPUs, GPUs, MCUs, and SoCs and their role in powering future embedded systems, click here.

5 Key Takeaways from Axeda Connexion 2014

This year’s Axeda Connexion conference in Boston was full of interesting and insightful ideas and views of the future of M2M communications and the Internet of Things. A variety of global enterprises sponsored the event and contributed to various keynotes and sessions including AT&T, Broadcom, Deutsche Telekom, Intel, Oracle, Salesforce, Wipro, and many more. The Internet of Things will have a major impact on traditional business models for embedded hardware players, software vendors, service providers, network operators – everyone throughout the value chain. The change for end users will be as much cultural as it will be technological.

The following are five key takeaways from our time at Axeda Connexion 2014:

The bulk of the M2M opportunity is with assets already deployed today.
The leading industries for M2M solutions, such as Automotive, Industrial Automation, and Oil & Gas, all have equipment and devices featuring long lifecycles and high costs. End users are looking to connect their “dumb” devices and sensors to enable new applications in a very cost-sensitive manner. The need for connectivity in legacy equipment will drive embedded hardware market form factors that can easily augment a system with connectivity – either via modules, new chipsets, peripheral systems, etc.

Security is a paramount concern of IoT development.
Nearly every presentation or keynote highlighted security as a major concern for the development of connected systems. OEMs will need to regularly adjust to new threats in order to preserve the integrity of the device, platform, network, and last but not least, the data. The example frequently cited was the alarming lack of security found in many connected medical devices produced today. Ecosystem players will need to adapt new methods and lines of thinking to preserve trust (brand integrity) with end users when it comes to security in the IoT.

Those who adopt big data applications now will have a tremendous competitive advantage for years to come.
Big data applications such as asset monitoring, analytics, and remote services can enable several internal and external benefits, and these competitive advantages are only increasing due to lagging adoption from competitors. For instance, analytics can provide new insights for future product designs and help facilitate iterative development in an embedded world where time-to-market pressures are constantly growing. Big data applications can also enable newfound efficiencies for internal processes such as field service and operations. Markus Breitbach, Vice President of Global Sales & Marketing of Deutsche Telekom, claims that the ROI of connected solutions is less than a year for most end users.

Strategic partnerships are a requirement for scalability in the IoT.
Integration is the biggest strength of an IoT solution. As the value proposition of an embedded device shifts toward software from hardware, as a result of the proliferation of more-powerful processors, memory, and systems, traditional manufacturers will be required to become more IT-centric to supply more of the solution stack (and services). Doing so will require strategic partnerships with a variety of ecosystem players, particularly when supporting cellular connectivity or international deployments. Rob Sobie, Vice President, Healthcare at Emerson, said at his session (in so many words) that Emerson could never have pursued the IoT market on its own. To put that into perspective, Emerson generated about $24.6B in revenue last year and has approximately 132,000 employees worldwide.

Growth of M2M connectivity will be different for each industry.
Each industry will have its own timeline for adoption of connectivity and big data technology. One concern in areas such as the Medical and Financial industries will be tight regulations surrounding patient/personal data, which are exacerbated by international laws. Consumer applications, though, are already permeating in developed countries with the proliferation of mobile and wearable devices. The Industrial Automation and Energy industries, though, have very clear use cases and tangible benefits from enabling a connected solution, and will continue to be among the driving vertical markets for the IoT.

Growing Roots: Delivering Application Value with Microcontrollers

The appeal and value of traditional microcontrollers (MCUs) wanes with progressively integrated and intelligent embedded processing systems. Several leading suppliers are differentiating their MCU-based devices and solutions with new and innovative technologies to get a leg up on competitors in key vertical industries such as automotive and industrial automation & control. Mitigation of vertical application requirements will be imperative of embedded MCU suppliers moving forward, particularly as OEMs look to consolidate functionality and take advantage of increasingly powerful CPU cores.

For example, Freescale Semiconductor yesterday announced two new additions to its Power System Basis Chip (SBC) product line. The company’s SBCs are MCU-driven modules integrated with several popular voltage regulation functions for the automotive and industrial markets (e.g. Safety Watchdog, Fail Safe Monitoring, CAN power management, etc.). Freescale’s strategy includes allowing OEMs to substitute the MCU of the SBC with another from the company’s extensive processor product lines – enabling much greater flexibility with evolving application requirements (low power, functionality, performance) and BOM. These SBCs take full advantage of Freescale’s expertise and rich history in both power management and MCU technology and will help the company further secure its roots in these domains as a whole.

STMicroelectronics is another MCU supplier growing its value proposition with expanded functionality tailored for a broad set of vertical market applications. The company has been building up its Secure MCU product line over the past few years to enable protected communication for a variety of devices spanning mobile phones, identification cards, point-of-sale terminals, and more. STMicroelectronics’ Secure MCUs span a diverse array of banking and security certifications and can include support for a variety of cryptographic standards.

Freescale’s attach-compatible SBCs and STMicroelectronics’ Secure MCUs are just a couple examples of how embedded processor suppliers are adapting to escalating application requirements using their principal expertise in adjacent technologies. The days of the general-purpose MCU are numbered, and suppliers need to generate more value in new ways beyond incremental advances to legacy components to remain competitive.

What we’re excited for this week at Embedded World 2014

VDC Research has made the journey across the Atlantic again this year to the Embedded World tradeshow in Nuremberg, Germany. It is always exciting to see what industry leaders will be announcing and exhibiting at the show, and this year is no exception. The following is a brief list of some of the major exhibitors and announcements to look forward to over the next few days:

AMD
AMD will once again be present at Embedded World. AMD will be offering insight into their brand new Embedded G-Series SoC mini-ITX mainboard. The AMD booth will also feature live demos focused on casino gaming, industrial HMIs, factory automation, industrial tablets, digital signage, medical, security and surveillance, virtualization, and more.

ARM
ARM and Keil will be showcasing the latest edition of Keil MDK-ARM, MDK Professional, and ARM DS-5 Development Studio Professional Edition. MDK-ARM is a complete software development environment for ARM-based microcontrollers. Ease-of-use is a primary trait of the MDK-ARM development environment, though it is also powerful enough for a variety of demanding embedded applications.

IBM
Despite popular belief, IBM will not be selling its chip manufacturing plant, and is instead focusing on finding a joint-venture partner to continue manufacturing its semiconductors used in personal computers, game machines, and other devices. Currently, microelectronics manufacturing accounts for less than 2 percent of IBM’s revenue, but considering IBM’s efforts to find a joint-venture partner to help increase the competitiveness of their semiconductor unit, we’re hoping for some exciting news at Embedded World.

Intel
Intel, along with Wind River and McAfee, will be in attendance at Embedded World where the company will display how it is accelerating the development and deployment of intelligent devices, creating systems by connecting legacy devices to the cloud, and enabling end-to-end analytics to transform businesses with big data. Embedded hardware products such as Intel’s industrial motherboards with the newly developed Q87/ATOM/Bay Trail with fanless design, PCI BUS, and legacy serial ports will be on display amongst other innovative embedded systems.

Qualcomm
Qualcomm will be showing off its new automotive infotainment chipset, the Snapdragon 602A applications processor, featuring a quad-core Krait CPU, Adreno 320 GPU, Hexagon DSP, integrated GNSS baseband processing, and additional high-performance audio, video and communication cores. Qualcomm’s goal is to provide automotive OEMs with unprecedented, integrated connectivity options for connected infotainment systems.

Renesas
Renesas will be busy at Embedded World hosting Europe’s first MCU Car Rally competition; the company is offering the opportunity for teams of students from across Europe to design a self-guided car from a kit of mechanical components, using hardware and software supplied by Renesas. Renesas will also be showcasing a variety of products including the R-Car family of SoCs, industrial Ethernet solutions, RX Functional Safety solutions, and more.

Intel’s Sub-Atom Quark is a Big Opportunity

Intel finally announced earlier this week its answer for branching into true low-power embedded applications – the Quark SoC. Quark is Intel's first product for low-cost, small form-factor embedded markets, which often prioritize power consumption and footprint over performance. Though Intel faces tough competition in the embedded space from a variety of players, the growing opportunity generated by the pervasive Internet of Things will be large enough for Intel to carve additional share outside traditional PC and enterprise-computing markets.

Quark is Intel's first synthesizable CPU core, allowing others to incorporate third-party silicon IP into the SoCs Intel will manufacture. Technical details are scarce, but what we do know is the demonstration chip presented at IDF 2013 is x86 compatible, measures 1/5th the size and 1/10th the power consumption of the Atom processor, and contains a single-core, single-thread 32-bit architecture.

The market opportunity for Quark is great. Connectivity is creeping into ever-more devices and applications, including the new SoC’s initial targets such as industrial automation, medical, and wearable devices. Though prospective customers can integrate various WiFi/cellular radios to enable connectivity, software remains the chief barrier to successful implementation. Intel hopes to mitigate development efforts through incorporating a software stack that includes security, manageability, and connectivity features. No word yet on supported standards.

However, IP-licensor ARM and processor suppliers such as Freescale and Qualcomm already have a firm foothold in several embedded markets. The ARM architecture has flourished in low-power designs, and now intends to challenge Intel in high-density server and high-performance computing markets. Quark is poised to compete with ARM’s Cortex-M series processors, the most used ARM architecture cited by over half of respondents from our 2013 Embedded Hardware End User Survey. The rich ARM ecosystem offers vast resources and integration support that no single company can completely encapsulate.

While there is no off-the-rack market for Quark, OEMs and other embedded processor end users will greatly value the advanced production process and additional features. The limiting factor of Intel’s success will be price. The company isn’t accustomed to selling lower-cost units beyond its Atom line – which are still too costly for many high-volume embedded applications beyond tablets and handsets. Nevertheless, we believe Intel’s strong brand and ample resources will allow Quark to penetrate several new embedded market segments once production begins later this year.

At the Design West – Embedded Systems Conference 2013 – Part 2

In this blog we will continue to provide a few more highlights from the suppliers we spoke to at the 2013 DESIGN WEST / Embedded Systems Conference that was held last week in San Jose.

Small Form Factor Motherboards: At the VersaLogic booth we were shown several of their new small form factor motherboards, including the EBX format Copperhead that is powered by an Intel i7 processor and can support up to 3 independent displays. We also saw their COM Express Mini format Falcon and EPIC format Iguana that are powered by Intel Atom processors. The Iguana boards have a Mini PCIe card socket that allows an OEM to round out its configuration with a wide array of connectivity, storage, and other options. All of the Versalogic products we saw at the show were designed for extremely high reliability in operating temperatures that extend from -40C to +85C, and many of them can be ordered in Class 3 assembly versions for mission critical applications.

Computers-on-Modules (COMs): At the congatec booth we saw the variety of COM product lines they offer including Qseven, COM Express, ETX, and XTX. If customers require high power COMs in passive cooling configurations, congatec has patented spring loaded heatspreader thermal interfaces that pull heat away from chipset components and transfer it to the edge of the module. Depending on the OEM application, many of the congatec Qseven products can be ordered with x86 processors from AMD and Intel or ARM processors from Freescale.

Development Platforms: At the ST Micro booth we visited with Ayla Networks who were demonstrating their proof-of-concept secure M2M cloud connectivity solutions with the STM32 F3 evaluation platforms representing connectivity targets. We expect to hear more from Ayla in the future, and you will likely be reading about them in our blog. At the Texas Instruments booth we were shown the new BeagleBoard Black open-source development platform. This impressive unit sells for only $45, and has a 1 GHz ARM A8 processor, 512MB of DDR3 RAM memory, and an on-board HDMI. The BeagleBoard can be expanded for multiple applications by using BeagleBone “capes”. There were multiple applications highlighted, including a remotely controlled electro-mechanical spider that had been fabricated using 3D printed parts.

Ultra Low Power MCUs: We noted that ST Micro had won an EE Times / EDN ACE Award for its Fully-Depleted Silicon-on-Insulator (FD-SOI) technology that allows devices to run using 20 – 50% less power. On a similar note, Renesas was demonstrating the power sipping ability of its RX111 group of MCUs that can wake up in 4.8us from a sleep mode, where it only consumes 350nA. In addition, the RX111 has 6 safety functions to verify/ensure that the device and supporting circuitry are working properly.

Industrial SATA III SSD: The VDC team met with Innodisc and learned about their new SATA III line of Flash Storage Products targeted at embedded applications in the industrial market.  These Innodisc products use arrays of lower-cost Multi-Layer Cell (MLC) memory chips to duplicate Single-Layer Cell performance and reliability at a significantly lower price point.

Embedded Certainty: At the XMOS booth we learned about their series of MCUs that were designed to remove uncertainty from critical applications. This means that programs can be developed where the signal timing is completely predictable. Roughly stated, the XMOS MCU have removed I/O layers and other elements that create signal latency or processing variables that can affect timing. There are many applications such as digital audio and collision avoidance that can benefit from MCUs with predictable timing.

Embedded Motherboards: As the VDC EHW team is currently in the midst of our supply-side coverage of the embedded motherboard market, we were particularly interested in seeing the two new SuperMicro X9DR products. Both of these units were extremely powerful and can be used in applications that require power-efficient processing of high volumes of data. SuperMicro also sells its products into the traditional IT space and, as such, has some system options that can be attractive to OEMs supporting mission critical applications. These include built in Uninterruptible Power Supply and automatic flash memory backup of system RAM and CPU processes in the event of a power outage.

Stay tuned for part 3 where we will wrap up our observations from the 2013 Design West show. 

At the Design West – Embedded Systems Conference 2013 – Part 1 the Embeddy

Last week, while attending the 2013 DESIGN West/Embedded Systems Conference in San Jose we presented the VDC Research Embeddy Award for the best new embedded hardware product. As part of the selection process the VDC Embedded Hardware team met with more than 30 companies to discuss product announcements and a variety of industry trends impacting the embedded hardware market today. Before we get to the award winner, we will start with a few highlights from some of the suppliers we spoke to at the show.

Connectivity enhanced Microcontrollers: Microchip usually makes several significant embedded hardware announcements at DW/ESC shows and this year was no exception.  VDC was given a detailed briefing on several new connectivity modules that OEMs can use for many applications. If the OEM's product already has a computing element, the new microchip modules are designed to easily integrate the needed Bluetooth, Wi-Fi, ZigBee, MiWi, and/or proprietary network types. If the OEM’s engineers have not settled on a processing element to interface with sensors or product components they might consider the modules that include integrated MCUs. The good news for OEMs is that the selection of any of these Microchip modules will likely eliminate product testing for overall FCC compliance and production test and calibration. Microchip demonstrated how a lighting OEM might integrate these new products in a way that would enable lighting products to be controlled in M2M applications including network based portals and authenticated mobile devices.

Secure M2M: Our next stop at the show was with Icon Labs and they were highlighting a new barrier/firewall device that was well suited for supporting M2M on legacy equipment in industrial applications. The unit we saw was targeted for a market price of ~$1K but included many security elements using Intel Atom processing and embedded software from Icon Labs’ partners including Wind River, ZiLog, McAfee, and Green Hills.

New Rugged Handheld Devices: At our next stop, the VDC EHW team was greeted by the enthusiastic ADLINK team and they had every right to be that way. There were a number of interesting products in many categories.  We were particularly interested in ADLINK’s foray into the enterprise handheld device market with the IMX-9000 which includes barcode reading capability, multiple connectivity protocols all contained in a stylish but rugged enclosure that is said to withstand IP67 and 1.5M drop tests. While at the ADLINK booth, we saw the new Advanced TCA processor blade. The new aTCA-9300 is well suited for media delivery platforms because of the need for scalable processing to deliver content in the needed forms and formats for the transmission and end use by the target device.

Media Processing: As a bit of background, it is not feasible to store content in all forms and formats suitable for delivery to, and use by, the huge numbers of things used to view them. This means that content has to be converted on the fly and that means there is a huge need for embedded processing products to perform these tasks.

ASICs and FPGAs: We received updates on the latest developments in the world of ASICs and FPGAs. We spoke with Altera who divides the majority of the FPGA market with Xilinx.  Altera  provided an update on the SoC FPGA line that was introduced in late 2011. The Cyclone V and Arria V FPGAs incorporate ARM CPU cores with FPGAs to allow OEMs to develop more powerful and flexible product designs while economizing on needed circuit board space.  One advantage that FPGAs normally have over ASICS is that they take less time to design and can be brought into production faster. If design issues are discovered at later stages, they can be corrected faster and at lower cost. The Altera inclusion of ARM cores allows OEM engineers to leverage many development tools that are available for ARM and that theoretically increases the advantages over traditional ASIC processes.

On the ASIC side, we received a briefing by Triad Semiconductor on their ViaASICs  and the associated development toolset ViaDesigner. The goals of these two products is to eliminate the time-to-market and development cost advantages of FPGA products over ASICs. The process works like this. In the semiconductor fab, the wafers are started and arrays of circuits and functional blocks are laid down but not configured and interconnected. These are then stocked until needed. An OEM engineer then uses the development tool that determines how the Triad chip will be configured. The data from that tool is sent to the fab and they create the mask(s) needed to for the next steps in the wafer creation process. The next steps lay down the layers needed for connecting the functional blocks creating a finished product.

New SBCs: Advantech highlighted a new compact design Single Board Computer (SBC) called the MIO-5290 that can be ordered with 3^rd Gen Intel i3 or i7 processors. With its ability to drive 3 independent displays with intense graphics, and the availability to add various I/O modules to customize the product, the MIO-5290 is well suited for many applications such as intelligent signage. The VDC team identified the MIO as one of the finalists in the Embeddy Award selection process.

Another finalist in the Embeddy Award selection process was WinSystems SBC35C series of products that utilize the 800 Mhz Freescale  i.MX 6Q Industrial Processor. There were several things that impressed us. The SBC35C board layout was very well thought out with industrial bus connections all on one side and the other needed connections on the other. The SBC35C can be run with Power over Ethernet (PoE) or a single DC source. The last thing that impressed us was the fact that the WinSystems team was showing their product the proper respect by handling the demo SBC with an anti-static bag. If they do that on the show floor, you can expect that their production and test process is also using similar precautions.

2013 Hardware Embeddy Winner: And now, without further ado, the winner of the VDC Hardware Embeddy award for the 2013 Design West / ESC show was AMD for their new G-Series family of SoC processors that we believe will make a big impact in the embedded hardware market.